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SDMG0340L /LA /LC /LS
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
?
Low Forward Voltage Drop
?
Fast Switching
?
Ultra-Small Surface Mount Package
?
PN Junction Guard Ring for Transient and ESD Protection
?
Lead Free/RoHS Compliant (Note 3)
?
"Green" Device (Note 4 and 5)
Mechanical Data
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Case: SOT-323
?
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
?
Moisture Sensitivity: Level 1 per J-STD-020D
?
Terminals: Solderable Per MIL-STD-202, Method 208
?
Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe)
?
Terminal Connections: See Diagram
?
Marking Information: See Page 3
?
Ordering Information: See Page 3
?
Weight: 0.006 grams (approximate)
Top View
SDMG0340L
SDMG0340LA SDMG0340LC SDMG0340LS
Maximum Ratings
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
SDMG0340L /LA /LC /LS
Document number: DS30248 Rev. 12 - 2
1 of 4
www.diodes.com
July 2008
? Diodes Incorporated
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40
V
RMS Reverse Voltage
VR(RMS)
28
V
Forward Continuous Current (Note 1)
IFM
30
mA
Non-Repetitive Peak Forward Surge Current @ t = 8.3ms
IFSM
200
mA
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
PD
200
mW
Thermal Resistance Junction to Ambient Air (Note 1)
RθJA
625
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-40 to +125
°C
Electrical Characteristics
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
V(BR)R
40
?
?
V
IR
= 10
μA
Forward Voltage
VF
?
295
370
mV
IF
= 1.0mA
Leakage Current (Note 2)
IR
?
150
1000
nA
VR
= 10V
Total Capacitance
CT
?
2.0
?
pF
VR
= 1V, f = 1.0MHz
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001,
which can be found on our website
at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date
code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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